Taiwanese semiconductor IP provider M31 Technology has announced the successful tapeout of its eUSB2V2 interface IP on TSMC’s ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--TSMC (TWSE: 2330, NYSE: TSM) today debuted its latest innovation in its most advanced process technology at the Company’s 2026 North America Technology Symposium.

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. In a joint announcement reflecting the growing importance of ...

KLAC's record fiscal Q3 revenues, rising advanced packaging outlook and AI-driven process control demand position it as a key semiconductor winner.

AI-driven design solution enables circuit optimization, saving weeks of manual and iterative effort while increasing design quality. Interoperable process design kits for all advanced TSMC FinFET ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

U.S. IT giant IBM has unveiled the world’s first semiconductor process technology below 1 nanometer (nm·one-billionth of a ...

Multi-generational agreement advances Intel’s IDM 2.0 strategy. Partnership broadens and accelerates IP access for Intel foundry ecosystem. Agreement builds on longstanding IP and EDA strategic ...

Collaborative R&D at Applied’s EPIC Center in Silicon Valley will enable higher yields and faster commercialization of next-generation ...