Ahead of TSMC’s October 15 earnings call, expectations are building as Elon Musk’s confirmation of talks over a potential ...

China has reportedly built up a sizable stockpile of advanced DUV lithography equipment despite tightening export controls, ...

The rapid growth of AI is reshaping the DRAM and HBM markets, increasing demand for specialized equipment to test advanced ...

CS Microelectronics, a subsidiary of Vital Technology Group , recently announced the successful development of a high-power ...

騰訊正轉向海外雲端基礎設施，以確保獲得中國境內無法取得的先進人工智慧運算能力。根據路透社引述《金融時報》報道，騰訊已與美國雲端服務供應商甲骨文簽署了迄今規模最大的海外租賃協議，獲得了約10萬顆先進人工智慧晶片的使用權。這項為期五年的協議涵蓋甲骨文在東 ...

Samsung Electronics’ growing HBM4 business is helping support its foundry operations as the company works to narrow losses.

Micron and Nanya Technology are stepping up investments in Taiwan as memory makers expand advanced DRAM and AI-related ...

特斯拉正在削減其下一代人工智慧晶片的記憶體容量，以確保Optimus大規模生產的充足供應，同時降低成本。根據Wccftech報導，馬斯克表示，特斯拉AI5將採用72GB的LPDDR5內存，僅為先前計畫容量的一半；而AI6將使用144GB的LPDDR6內存，減少了約三分之一。

美光科技2026財年業績創歷史新高，主要得益於強勁的記憶體價格和人工智慧驅動的資料中心需求激增。根據Investing.com報道，該公司第四財季營收達542億美元，季增31%，年增379%。全年營收達1,332億美元，年增256%。這項業績也標誌著 ...

TSMC is reportedly considering a major U.S. expansion beyond Arizona. According to Economic Daily News, sources say the ...

As AI chips grow larger and more complex, glass substrates are emerging as a potential next step in advanced packaging.

Anthropic’s IPO filing sheds new light on the AI developer’s growing reliance on a small group of technology partners.