Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is ...

Cisco Systems has acquired semiconductor company Leaba Semiconductor for $350-$400 million. Leaba was established in 2014 and operates in stealth mode. According to Leaba’s website “Leaba is a fabless ...

Iddq testing is one of the many ways to test CMOS integrated circuits in production. These circuits are usually tested as a way to find different types of manufacturing faults. Electric faults can be ...

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, ...

That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.

Synopsys (Nasdaq: SNPS) and OpenAI today announced a strategic partnership that brings together OpenAI’s advanced AI ...

What Is a QFN Package? QFN stands for Quad Flat No-Lead. It belongs to the broader family of bottom-termination components (BTCs). Instead of using leads that extend outside the package, the ...

Verify Device Functionality: Confirm logic, analog, RF, or memory blocks operate per specification. Characterize Parametric Performance: Measure leakage currents, threshold voltages, timing margins, ...

The semiconductor industry’s AI investment cycle has largely been associated with advanced logic, HBM memory and increasingly ...

Finding experienced ASIC verification engineers can be difficult when your chip project requires strong UVM, SystemVerilog, coverage, formal verification, protocol knowledge or complex SoC-level debug ...

September 03, 2026 − Chiplet architectures enable complex systems to be built by combining multiple dies within a single ...