Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is ...
Adesto Technologies, a leading provider of innovative application-specific semiconductors for the IoT era, announced it has acquired Dublin-based S3 Semiconductors, a global supplier of mixed-signal ...
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Cypress Semiconductor Corporation (NASDAQ: CY) today announced that the companies have signed a definitive agreement under which Infineon will ...
Synopsys (Nasdaq: SNPS) and OpenAI today announced a strategic partnership that brings together OpenAI’s advanced AI ...
That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.
What Is a QFN Package? QFN stands for Quad Flat No-Lead. It belongs to the broader family of bottom-termination components (BTCs). Instead of using leads that extend outside the package, the ...
For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, ...
Iddq testing is one of the many ways to test CMOS integrated circuits in production. These circuits are usually tested as a way to find different types of manufacturing faults. Electric faults can be ...
Tapeout is a major milestone in every ASIC project lifecycle. It means the design phase is completed and you are ready to send out the GDSII to the fab for production. The term “tapeout” was coined in ...
Finding experienced ASIC verification engineers can be difficult when your chip project requires strong UVM, SystemVerilog, coverage, formal verification, protocol knowledge or complex SoC-level debug ...
The semiconductor industry’s AI investment cycle has largely been associated with advanced logic, HBM memory and increasingly ...
Finding an experienced analog layout designer can be one of the most important steps in a successful analog or mixed-signal IC project. Even a strong schematic can lose performance if the physical ...