HUAWEI's He Tingbo presents a sustainable evolutionary path for semiconductors enabled by shifting from geometric to time scaling, delivering benefits across the industry as a whole.

With HUAWEI Kirin 2026 launching later this year, HUAWEI’s He Tingbo showcases the big leap ahead for semiconductors supported by LogicFolding.

It's been a long journey — 6 years and 381 chips to be exact — but HUAWEI's He Tingbo explains how HUAWEI's high-end chips are now expected to feature a transistor density that is equivalent to 14 Å (1.4 nm) processes by 2031.